The electronic thermal management materials market size was valued at US$ 2.94 billion in 2023 and is projected to reach US$ 4.83 billion by 2031; it is anticipated to record a CAGR of 6.4% from 2023 to 2031.

The electronic thermal management materials market is experiencing robust growth, driven by the increasing demand across sectors such as consumer electronics, automotive, and telecommunications. As electronic devices become more powerful, compact, and complex, managing the heat generated by components becomes critical to ensure performance, reliability, and longevity. Thermal management materials are designed to efficiently dissipate heat, thus preventing overheating and improving device performance. In the consumer electronics sector, the rising adoption of devices such as smartphones, tablets, and gaming consoles is boosting the need for effective heat management solutions. The automotive industry is another significant market driver, particularly with the growth of electric vehicles (EVs) and autonomous driving technologies, which involve high-powered electronics that demand efficient cooling solutions. Additionally, the telecommunications industry, especially with the expansion of 5G infrastructure, relies heavily on advanced thermal management materials to handle high-performance network equipment.

Based on product type, the electronics thermal management materials market is segmented into conductive adhesives, thermal management films, gap fillers, thermal gels, phase change materials, thermal greases, and others. In 2023, the thermal greases segment held the largest market share. Thermal greases, also known as thermal pastes or thermal compounds, are highly effective materials used to enhance heat transfer between heat-generating components and their cooling solutions, such as heat sinks or spreaders. Composed of a silicone or non-silicone base infused with thermally conductive fillers such as metal oxides, ceramic particles, or carbon-based materials, thermal greases are designed to fill microscopic imperfections on surfaces and create a seamless interface for optimal thermal conduction. This eliminates air gaps, which are poor conductors of heat, and significantly lowers thermal resistance, allowing heat to move more efficiently away from critical electronic parts such as CPUs, GPUs, power modules, and LED systems.

In 2023, North America had a significant electronic thermal management materials market share. The North America electronic thermal management materials market is anticipated to witness lucrative opportunities during the forecast period, owing to the growth of various industries, including electronics, telecommunication, aerospace, and automotive. With the expansion of high-performance computing, data centers, electric vehicles (EVs), 5G infrastructure, and consumer electronics industries, thermal management has become a critical factor in ensuring device longevity and reliability. The proliferation of 5G networks and the demand for high-speed internet connectivity in North America are further boosting the need for thermal management materials. The expansion of 5G infrastructure has introduced new electronic components, including antennas, base stations, and network equipment, that require efficient cooling to maintain connectivity and performance.

DuPont de Nemours Inc, Henkel AG & Co KGaA, Electrolube Ltd, Tecman Speciality Materials Ltd, Momentive Performance Materials Inc, 3M Co, European Thermodynamics Ltd, Honeywell International Inc, Parker Hannifin Corp, Wacker Chemie AG, Sur-Seal Corp, Graco Inc, Robnor ResinLab Ltd, Master Bond Inc, and Marian Inc are among the prominent players profiled in the electronic thermal management materials market report. In addition, several other players have been studied and analyzed during the study to get a holistic view of the market and its ecosystem. The electronic thermal management materials market report also includes company positioning and concentration to evaluate the performance of competitors/players in the market.



The overall global electronic thermal management materials market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights into the topic. Participants in this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the electronic thermal management materials market.