The embedded die packaging technology sector was valued at approximately US$ 63.40 million in 2020 and is anticipated to grow to US$ 242.80 million by 2028. This market is projected to experience a compound annual growth rate (CAGR) of 18.6% from 2021 to 2028.
The COVID-19 pandemic had a detrimental impact on the overall growth trajectory of the global embedded die packaging technology market in 2020. This downturn can be linked to a decrease in revenue and growth among companies in the sector, primarily due to disruptions in supply and demand throughout the semiconductor and advanced packaging industry value chain. Additionally, in 2019, the market growth rate was hindered by a slowdown in the semiconductor industry, reduced demand for mobile phones, and ongoing trade disputes. Nevertheless, the promising growth potential from the use of embedded die packaging in the automotive and medical fields is expected to facilitate a recovery in market growth during the forecast period from 2021 to 2028.
The global embedded die packaging technology market is categorized into four primary regions: North America, Europe, Asia-Pacific (APAC), and Rest of the World. In 2020, the APAC region dominated the market, accounting for 50.5% of the total revenue. North America boasts a robust presence of advanced electronic devices that are compatible with cutting-edge networking systems. Furthermore, the Asian market is experiencing significant growth in embedded die packaging technology, driven by the rising adoption of smartphones and wearable technology. In emerging economies like India and China, the market is propelled by the increasing consumption of smartphones and medical devices, leading to a greater demand for embedded die packaging technology due to the trend towards miniaturization of electronic devices and the need for compact electronics. China, in particular, holds a substantial share of the embedded die packaging technology market. Meanwhile, European nations such as the UK, Italy, and France are moving towards greater digitalization and automation, further stimulating market growth.
In North America, the United States stands out as the most advanced country in terms of technology adoption. The US is recognized as an early adopter of innovative technologies, and there is a significant demand for newly developed compact electronics in this region. The adoption rates of Internet of Things (IoT) technologies, high-end smartphones, and various other devices are notably higher in the US compared to its North American counterparts. This trend encourages providers of embedded die packaging technology to concentrate their efforts on developing or innovating solutions for a diverse array of applications.
The overall size of the embedded die packaging technology market has been determined through a combination of primary and secondary research methods. The research process commenced with extensive secondary research utilizing both internal and external sources to gather qualitative and quantitative data related to the embedded die packaging technology market. This approach also aims to provide a comprehensive overview and forecast for the embedded die packaging technology market across all segments. It includes an overview and forecast for the global embedded die packaging technology market segmented by the four major regions: North America, Europe, Asia-Pacific, and Rest of the World. Additionally, primary interviews were conducted with industry participants and commentators to validate the data and gain deeper analytical insights into the subject matter. Participants in this process included industry experts such as vice presidents, business development managers, market intelligence managers, and national sales managers, as well as external consultants like valuation experts, research analysts, and key opinion leaders specializing in the embedded die packaging technology market.
Key players in the embedded die packaging technology market include ASE Group, Microsemi, General Electric Company, Taiwan Semiconductor Manufacturing Company, Limited, Fujikura Ltd., Shinko Electric Industries Co., Ltd., Schweizer Electronic AG, Amkor Technology, Inc., Infineon Technologies AG, and AT & S Austria Technologie & Systemtechnik Aktiengesellschaft. In addition to these major players, numerous other significant market participants from the entire value chain have been analyzed to provide a comprehensive view of the global embedded die packaging technology market and its ecosystem.