According to our latest study on "Substrate-Like PCB Market Forecast to 2031 - Global and Regional Share, Trend, and Growth Opportunity Analysis - by Line/Space, Fabrication Process, and Application," the market was valued at US$ 2.97 billion in 2024, and the Substrate-Like PCB market size is projected to reach US$ 7.16 billion by 2031. The Substrate-Like PCB market is expected to record a CAGR of 13.4% from 2024 to 2031.

Integration of 5G Communication Technology to Provide Lucrative Opportunities for Substrate-Like PCB Market Growth During the Forecast Period

5G communication technology is expected to empower new business models and use cases in a wide range of PCB applications, especially in the telecommunication industry, in the coming years. 5G provides higher data rates, massive device connectivity, and lower latency compared to previous generations of communication technology. 5G networks are one of the major issues in handling millimeter-wave frequencies (24 GHz to 100 GHz), which are critical for reaching the data throughput and capacity required by 5G. This issue generates the demand for substrate-like PCB for improved impedance management, low signal loss, and decreased electromagnetic interference (EMI). These qualities are critical for ensuring signal quality in high-frequency applications, including 5G base stations, antennas, and user devices. Moreover, there is a rise in investment and adoption of 5G in various industries, such as consumer electronics, automotive, medical, data centers, and industrial. For instance, according to Federal Communications Commission data of August 2024, telecom operators across the globe are planning to invest US$ 900 million in the deployment of 5G, prioritizing Open RAN, and focus on new services for consumers and enterprises. Smartphones, wearable technologies, Internet of Things (IoT)-based devices, and other 5G-enabled devices need compact, lightweight, and high-performance PCBs. Substrate-like PCBs are an ideal alternative, as this device allows higher levels of integration and can handle complex, high-density interconnections. The dependability of substrate-like PCBs is critical in 5G applications. Substrate-like PCBs are capable of handling the thermal and mechanical pressures inherent in high-frequency applications, extending the life of the components used in the 5G network. Therefore, the growing adoption of 5G communication technology is anticipated to create lucrative opportunities for the substrate-like PCB market growth during the forecast period.

Key Findings of Substrate-Like PCB Market Study:

The Substrate-Like PCB market analysis has been carried out by considering the following segments: Line/Space, Fabrication Process, and Application. On the basis of line/space, the substrate-like PCB market is segmented into 25/25 and 30/30