Assembly and testing (manufacturing) of outsourced semiconductors offer IC-packaging and testing facilities to third parties. OSATs are merchant vendors. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations. Fabless companies often outsource their packaging to the foundries and/or the OSATs. Semiconductors are also used by many modern consumer goods in daily life, such as cell phones, laptops, video cameras, televisions, washing machines, refrigerators, and LED bulbs. Growing popularity of smart TVs, 4 K ultra-HD TVs, 3D programming, video-on - demand content, a preference for large displays, and curved OLEDs drives OSAT revenues. OSATs offer cost-effective and creative solutions which deliver higher efficiency, processing speeds and functionality with space reduction in an electronic device.
MARKET DYNAMICS
Global OSAT market is a moderately competitive market with various global and regional players present on the market. Commercial foundries controlled the production of semiconductors earlier, while IC assembly and testing were dominated by outsourced semiconductor assembly and test (OSAT) market. Yet as the industry shifts toward stacked die over the next few years, massive foundries want to extend their presence worldwide. There are various factors that drive market growth, including factors such as the growing demand for consumer electronics and the increase in global urbanization. Factors that serve as a business opportunity include the increasing transition in emerging economies, as well as the increase in smartphone adoption is expected to provide lucrative opportunities for OSAT market.
MARKET SCOPE
The "Global Outsourced Semiconductor Assembly and Test (OSAT) Market Analysis to 2028"? is a specialized and in-depth study of the outsourced semiconductor assembly and test (OSAT) market with a special focus on the global market trend analysis. The report aims to provide an overview of outsourced semiconductor assembly and test (OSAT) market with detailed market segmentation by services, packaging, industry vertical. The global outsourced semiconductor assembly and test (OSAT) market expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading outsourced semiconductor assembly and test (OSAT) market player and offers key trends and opportunities in the outsourced semiconductor assembly and test (OSAT) market.
MARKET SEGMENTATION
The global outsourced semiconductor assembly and test (OSAT) market is segmented on the basis of services, packaging, industry vertical. On the basis of services, market is segmented as assembly, testing. On the basis of packaging, market is segmented as ball grid array, chip scale package, multi-package, stacked die, quad and dual. On the basis of industry vertical, market is segmented as automotive, telecommunications, computing and networking, consumer electronics
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global outsourced semiconductor assembly and test (OSAT) market based on various segments. It also provides market size and forecast estimates from year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The outsourced semiconductor assembly and test (OSAT) market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.
The report analyzes factors affecting outsourced semiconductor assembly and test (OSAT) market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the outsourced semiconductor assembly and test (OSAT) market in these regions.
MARKET PLAYERS
The reports cover key developments in the outsourced semiconductor assembly and test (OSAT) market organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from outsourced semiconductor assembly and test (OSAT) market are anticipated to lucrative growth opportunities in the future with the rising demand for outsourced semiconductor assembly and test (OSAT) market. Below mentioned is the list of few companies engaged in the outsourced semiconductor assembly and test (OSAT) market.
The report also includes the profiles of key outsourced semiconductor assembly and test (OSAT) market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.
- ASE Group
- UTAC
- SPIL
- Amkor
- TFME J
- ECT
- ChipMOS
- TSHT
- Powertech Technology Inc
- Chipbond
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