North America SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics,